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Lam and Imec pursue 3-D integration

By bringing together Lam’s capabilities in deposition and etch with imec’s world-class integration infrastructure, the collaboration is designed to boost the velocity with which promising innovations move from the lab to high-volume manufacturing. The collaboration focuses on key process challenges…

nsf.gov
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Podcast: The future of electronics goes beyond circuit boards

NSF-supported researcher Ethan Secor discusses a specialized additive manufacturing technique, the materials involved, and the resulting circuits that can be customized for complex 3D surfaces... Podcast: The future of electronics goes beyond circuit boards New and ambitious ideas lay the foundation…

Intel Core (Desktop & Mobile)

Core‑series CPUs, architectures, efficiency/performance cores, and platforms.

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