4+ day, 12+ hour ago   (400+ words) Sony and TSMC have signed a definitive agreement for the establishment of a joint CMOS image sensor venture in Japan. The venture, called Advanced Vision Semiconductor Manufacturing Corp., will serve as a core hub for the development and manufacturing activities…...

4+ day, 19+ hour ago   (204+ words) Bassel Haddad has been named group chief executive and executive director of ASMPT, a supplier of equipment for the packaging industry. Haddad succeeds Robin Ng, who retires after more than 20 years with ASMPT, including six years as group CEO and…...

5+ day, 6+ hour ago   (318+ words) A new company called Discovered Materials has received funding and disclosed its initial product—an AI-based materials discovery technology. Based in San Francisco, Discovered Materials is a startup that is building AI agents capable of discovering and accelerating the adoption…...

1+ week, 1+ day ago   (189+ words) These startups are separately developing new packaging-based products to address the bottlenecks in AI data centers and other applications. The financing values Lumilens at $5.51 billion and brings its total capital raised to over $900 million. In two years after its founding,…...

1+ week, 4+ day ago   (700+ words) At the Future of Memory and Storage (FMS) 2026 conference in Santa Clara, Calif., Samsung unveiled several next-generation 3D memory technologies. Samsung rolled out the following technologies: In this article, I will describe each technology. But first, let’s briefly look at Samsung....

2+ week, 3+ day ago   (200+ words) Taiwan’s United Microelectronics Corp. (UMC), a large foundry vendor, is expanding its fab capacity and increasing its capital spending. UMC will expand its capacity at its existing fab site in Singapore. In addition, the company will also begin the construction…...

2+ week, 3+ day ago   (389+ words) The foundry industry, a key part of the semiconductor business, involves a number of companies called foundry vendors. These vendors make chips for other companies in large manufacturing facilities called fabs. Outsourced semiconductor assembly and test (OSAT) vendors are also…...

2+ week, 5+ day ago   (546+ words) In a move to secure more external manufacturing capacity, Broadcom has formed separate alliances with Samsung and Powertech Technology Inc. (PTI). In one announcement, South Korea’s Samsung and U.S.-based Broadcom signed a memorandum of understanding (MOU) on the foundry…...

3+ week, 1+ day ago   (516+ words) Intel posted mixed financial results for the second quarter ended July 23. The company saw strong demand for its processor lines in the market, but it also reported another loss in the quarter. During the second quarter, Intel’s foundry unit also…...

3+ week, 2+ day ago   (990+ words) Multibeam Corp. has rolled out its next-generation multi-column e-beam lithography system and has received an order for the product. National Tsing Hua University (NTHU) in Taiwan has ordered Multibeam’s new MBX multi-column e-beam lithography system for its College of Semiconductor…...